Our X-Ray Imaging in Real Time utilizes the latest in X-ray imaging technology built by Glenbrook Technologies for non-destructive inspection of electronic components.

Our vast and ever growing library of component images enables us to quickly and accurately perform internal comparative analysis against verified component images. The high resolution provided allows for continuity inspection of all wire bond interconnects and BGA ball placements.

This system also allows for single layer inspection of electronic components without removing them from tubes, trays or tape. This enables SMT to do an inspection without breaking the original factory sealed packaging.

SMT Corporation

14 High Bridge Road

Sandy Hook, CT 06482

Ph: 203.270.4700

Fx: 203.270.4799